Joong-Do Kim: search on Z-Library

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1

Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets

Raghavan, S., Klein, K., Yoon, S., Joong-Do Kim, Kyoung-Sik Moon, Wong, C.P., Sitaraman, S.K.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1.47 MB

english, 2011

2

Hydrogen transport through Pd-Ni alloy electrodeposited on Pd substrate

Woo-Jin Lee, Su-Il Pyun, Tae-Hyun Yang, Joong-Do Kim, Young-Ho Baek, Han-Gyu Kim

Journal:

Journal of Solid State Electrochemistry

Year:

1997

Language:

english

File:

PDF, 222 KB

english, 1997

3

Effect of hydrogen on stresses in anodic oxide film on titanium

Joong-Do Kim, Su-Il Pyun, Masahiro Seo

Journal:

Electrochimica Acta

Year:

2003

Language:

english

File:

PDF, 282 KB

english, 2003

4

Effects of applied current density and potential step on the stress generation during anodic oxidation of tungsten in 0.1 M H2SO4 solution

Joong-Do Kim, Su-Il Pyun, R.A. Oriani

Journal:

Electrochimica Acta

Year:

1995

Language:

english

File:

PDF, 664 KB

english, 1995

5

Effects of chloride ion and applied current density on the stress generation during anodic oxidation of tungsten in 0.1 M H2SO4 solution

Joong-Do Kim, Su-il Pyun, R.A. Oriani

Journal:

Electrochimica Acta

Year:

1996

Language:

english

File:

PDF, 658 KB

english, 1996

6

A study of the mechanism of oxygen reduction on bare palladium in 0.1 M LiOD solution using Pt ring-Pd disk electrode

Joong-Do Kim, Su-Il Pyun, Tae-Hyun Yang, Jeh-Beck Ju

Journal:

Journal of Electroanalytical Chemistry

Year:

1995

Language:

english

File:

PDF, 483 KB

english, 1995

7

Electroless nickel/gold bump in the flip-chip-type CMOS package for mobile-phone camera modules

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 272 KB

english, 2006

8

Effect of Complex Agent on Characteristics of Copper Conductive Pattern Formed by Ink-jet Printing

Lee, Young-In, Lee, Kun-Jae, Goo, Yong-Sung, Kim, Nam-Woo, Byun, Younghoon, Kim, Joong-Do, Yoo, Bongyoung, Choa, Yong-Ho

Journal:

Japanese Journal of Applied Physics

Year:

2010

Language:

english

File:

PDF, 685 KB

english, 2010

9

Ink-jet printing of Cu conductive ink on flexible substrate modified by oxygen plasma treatment

Yong-Sung Goo, Young-In Lee, Namwoo Kim, Kun-Jae Lee, Bongyoung Yoo, Sung-Jei Hong, Joong-Do Kim, Yong-Ho Choa

Journal:

Surface and Coatings Technology

Year:

2010

Language:

english

File:

PDF, 524 KB

english, 2010

10

Electrodeposition of palladium on the copper lead frame: Electrode reaction characteristics and the effects of primary additives

Jin-Woo Lee, Jeh-Beck Ju, Joong-Do Kim

Journal:

Korean Journal of Chemical Engineering

Year:

2007

Language:

english

File:

PDF, 354 KB

english, 2007

11

Effects of electrolyte composition and applied potential on the repassivation kinetics of pure aluminium

Joong-do Kim, Su-il Pyun

Journal:

Electrochimica Acta

Year:

1995

Language:

english

File:

PDF, 722 KB

english, 1995

12

Electroless Ni/Au Bump on a Copper Patterned Wafer for the CMOS Image Sensor Package in Mobile Phones

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 485 KB

english, 2007

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